[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Design and development of thermal-mechanical solutions for a community personal computer
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![[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Design and development of thermal-mechanical solutions for a community personal computer](/images/quick-response-icon.jpg){kind=icon}
内容摘要
[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Design and development of thermal-mechanical solutions for a community personal computer
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